Datasheet

Not Recommended for New Designs
VSP2582
SBES002B –JUNE 2008–REVISED JUNE 2011 www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Over operating free-air temperature range (unless otherwise noted).
VSP2582RHN
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DIGITAL INPUTS
Logic family CMOS
VT+ LOW to HIGH threshold voltage 1.7 V
Input voltage
VT– HIGH to LOW threshold voltage 1.0 V
I
IH
Logic HIGH, V
IN
= +3 V ±20 μA
Input current
I
IL
Logic LOW, V
IN
= 0 V ±20 μA
Input capacitance 5
V
CC
+
Maximum input voltage –0.3 V
0.3
DIGITAL OUTPUTS (DATA)
Logic family CMOS
Logic coding Straight Binary
V
OH
2.4 V
Output voltage
V
OL
0.4 V
Output data delay code = 00 0 ns
Output data delay code = 01 2 ns
Additional data output delay
Output data delay code = 10 4 ns
Output data delay code = 11 6 ns
POWER SUPPLY
V
CC
2.7 3.0 3.6 V
Supply voltage
V
DD
2.7 3.0 3.6 V
Power dissipation at 3.0 V 36 MHz 85 mW
Clocks (SHP/SHD/ADCCK) off mode
Standby mode power dissipation 1 mW
(at 3.0 V)
TEMPERATURE RANGE
Operation temperature –25 +85 °C
THERMAL INFORMATION
VSP2582RHH VSP2582RHNR
THERMAL METRIC
(1)
RHH RHN UNITS
36 PINS 36 PINS
θ
JA
Junction-to-ambient thermal resistance 31.7 81.0
θ
JCtop
Junction-to-case (top) thermal resistance 19.3 22.7
θ
JB
Junction-to-board thermal resistance 6.7 45.6
°C/W
ψ
JT
Junction-to-top characterization parameter 0.3 0.8
ψ
JB
Junction-to-board characterization parameter 6.7 44.9
θ
JCbot
Junction-to-case (bottom) thermal resistance 1.5 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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