Datasheet

ULN2003LV
SLRS059A –APRIL 2012–REVISED APRIL 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
T
A
PART NUMBER PACKAGE TOP-SIDE MARKING
ULN2003LVDR 16-Pin SOIC Reel of 2500 UN2003LV
–40°C to 85°C
ULN2003LVPWR 16-Pin TSSOP Reel of 2000 UN2003LV
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Specified at T
J
= –40°C to 125°C unless otherwise noted.
VALUE
UNIT
MIN MAX
V
IN
Pins IN1- IN7 to GND voltage –0.3 5.5 V
V
OUT
Pins OUT1 – OUT7 to GND voltage 8 V
V
COM
Pin COM to GND voltage 8 V
Max GND-pin continuous current (T
J
> +125°C) 700 mA
I
GND
Max GND-pin continuous current (T
J
< +100°C) 1.0 A
16 Pin - SOIC 0.58 W
P
D
Total device power dissipation at T
A
= 85°C
16 Pin -TSSOP 0.45 W
ESD Rating – HBM 2 kV
ESD
ESD Rating – CDM 500 V
T
A
Operating free-air ambient temperature range –40 85 °C
T
J
Operating virtual junction temperature –55 150 °C
T
stg
Storage temperature range –55 150 °C
(1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
DISSIPATION RATINGS
(1)(2)
BOARD PACKAGE θ
JC
θ
JA
(3)
DERATING T
A
< 25°C T
A
= 70°C T
A
= 85°C
FACTOR ABOVE
T
A
= 25ºC
High-K 16-Pin SOIC 69°C/W 112°C/W 8.88 mW/ºC 1.11 W 0.71 W 0.58 W
High-K 16-Pin TSSOP 74°C/W 142°C/W 7.11 mW/ºC 0.88 W 0.56 W 0.45 W
(1) Maximum dissipation values for retaining device junction temperature of 150°C
(2) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance
(3) Operating at the absolute T
J-max
of 150°C can affect reliability– for higher reliability it is recommended to ensure T
J
< 125°C
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