Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1) (2)
UCD8220
SLUS652D – MARCH 2005 – REVISED OCTOBER 2006
PACKAGING INFORMATION
POWER RATING T
A
RATING FACTOR
PACKAGE SUFFIX θ
JC
( ° C/W) θ
JA
( ° C/W) = 70 ° C, T
J
= 125 ° C ABOVE 70 ° C
(mW) (mW/ ° C)
PowerPad™
PWP 2.07 37.47
(1)
1470 27
MSSOP-16
QFN-16 RSA - - - -
QFN-20 RGW - - - -
(1) PowerPad™ soldered to the PWB with TI recommended PWB as defined in TI's Application Report ( TI Literature Number SLMA002 )
with OLFM.
SYMBOL PARAMETER UCD8x20 UNIT
V
DD
Supply Voltage 16 V
Quiescent 20
I
DD
Supply Current mA
Switching, T
A
= 25 ° C, T
J
= 125 ° C, V
DD
= 12 V 200
V
O
Output Gate Drive Voltage OUT -1 to PVDD V
I
O(sink)
4.0
Output Gate Drive Current OUT A
I
O(source)
-4.0
Analog Input ISET, CS, CTRL, ILIM -0.3 to 3.6 V
Digital I/O ’ s CLK, CLF -0.3 to 3.6
T
A
= 25C (PWP-16 package) 2.67
W
Power Dissipation T
A
= 25C (QFN-16 package) -
T
A
= 25C (QFN-20 package) -
Junction Operating
T
J
UCD8220 -55 to 150
Temperature
C
T
stg
Storage Temperature -65 to 150
HBM Human body model 2000
ESD Rating
(3)
V
CDM Charged device model 500
Lead Temperature (Soldering, 10 sec) 300 C
(1) Stresses beyond those listed under “ absolute maximum ratings ” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “ recommended operating
conditions ” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.
(3) Tested to JEDEC standard EIA/JESD22 - A114-B.
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