Datasheet
www.ti.com
CONNECTION DIAGRAMS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
HTSSOP PACKAGE (PWP −16)
UCD8220 (TOP VIEW)
NC − No internal connection
NC
CLK
3V3
ISET
AGND
CTRL
CLF
ILIM
NC
NC
VDD
PVDD
OUT1
OUT2
PGND
CS
3V3
ISET
AGND
CTRL
16
15
14
13
CLK
NC
NC
VDD
QFN PACKAGE (RSA−16)
UCD8220 (BOTTOM VIEW)
5
6
7
8
1
CLF
ILIM
NC
CS
2 3 4
12 11 10 9
PVDD
OUT1
OUT2
PGND
UCD8220
SLUS652D – MARCH 2005 – REVISED OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGED DEVICES
(1) (2) (3)
110-V HV STARTUP
TEMPERATURE RANGE
PowerPAD™
CIRCUIT
QFN-16 (RSA)
(4)
QFN-20 (RGW)
HTSSOP-16 (PWP)
-40C to 105C No UCD8220PWP UCD8220RSA -
(1) HTSSOP-16 (PWP), QFN-16 (RSA), and QFN-20 (RGW) packages are available taped and reeled. Add R suffix to device type (e.g.
UCD8220PWPR) to order quantities of 2,000 devices per reel for the PWP package and 1,000 devices per reel for the RSA and RGW
packages.
(2) These products are packaged in Pb-Free and Green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255C to 260C peak
reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
(4) Contact factory for availability of QFN packaging.
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Product Folder Link(s): UCD8220