Using the UCD3138LLCEVM-028 User's Guide Literature Number: SLUU979A August 2012 – Revised July 2013
www.ti.com WARNING Always follow TI’s set-up and application instructions, including use of all interface components within their recommended electrical rated voltage and power limits. Always use electrical safety precautions to help ensure your personal safety and the safety of those working around you. Contact TI’s Product Information Center http://support/ti./com for further information. Save all warnings and instructions for future reference.
User's Guide SLUU979A – August 2012 – Revised July 2013 Digitally Controlled LLC Resonant Half-Bridge DC-DC Converter 1 Introduction This EVM, UCD3138LLCEVM-028 is to help evaluate the UCD3138 64-pin digital control device in an offline power converter application and then to aid in its design. The EVM is a standalone LLC resonant halfbridge DC-to-DC power converter. The EVM is used together with its control card, UCD3138CC64EVM030, also an EVM on which is placed UCD3138RGC.
Description 2 www.ti.com Description The UCD3138LLCEVM-028 along with the UCD3138CC64EVM-030 demonstrates an LLC resonant halfbridge DC-DC power converter with digital control using the UCD3138 device. The UCD3138 device is located on the UCD3138CC64EVM-030 board. The UCD3138CC64EVM-030 is a daughter card with preloaded firmware that provides the required control functions for an LLC converter. For details of the firmware please contact TI.
Performance Specifications www.ti.com 3 Performance Specifications Table 1. UCD3138LLCEVM-028 Performance Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Input Characteristics Voltage operation range 350 Input UVLO On 325 Input UVLO Off 310 400 VDC A Input current Input = 350 VDC, full load = 29 A 1.2 Input current Input = 380 VDC, full load = 29 A 1.1 Input current Input = 400 VDC, full load = 29 A 1.
1 R38 10k Copyright © 2012–2013, Texas Instruments Incorporated 1 DGND R70 549 R71 100k (J3-13) 10k R72 R69 10k R50 124 TP13 OUTB 5 VDD 6 OUTA 7 ENBB 8 4 INB 3 GND 2 INA 1 ENBA 10nF C60 10 R67 12VS C57 GATE 8 Diode Oring Control 7 GND C 10 RSVD 9 5 OV 6 UV A 11 FLTR 12 3 STAT 4 FLTB BYP 13 PG 14 2 RSET 1 VDD LSG 10 C58 C59 10nF C61 100pF 9 10 6 2 5 1 C36 15nF L1 33uH 1 R28 1k C41 C38 C42 15nF TP8 D12 TP19 + C64 + C65 + 2 1 C66 + GND_PWR 1
Copyright © 2012–2013, Texas Instruments Incorporated 1 GND_PWR D23 D22 D21 100pF VAUX_P 0.1uF C1 -VIN -VAUX_-VIN VAUX_P VIN+ U1 PWR050 BUS+_HV_PRI 1 Isolation Line DGND D2 1 1 BAT54S 3_3VD C3 2.2uF R2 1 1 6 C4 0.1uF 7 U8-A 1 1 SRDET2 (J2-24) J7 VIN_MON=1.93V AT VIN=400V 1 DGND 4 GND 3 NC 2 NC FB/NC 5 NC 6 NC 7 OUT 8 1 3_3VD OFF SW1 5.11k (J3-22) ON/OFF D3 R4 301 R3 1 AGND 10nF C18 3_3VA DGND VO 3 C19 10nF (J2-28) TEMP AGND 0.
TP6 AD-12 AD-13 AD-10 AD-11 AD-09 DGND /RESET 3.
Schematics www.ti.
Test Setup www.ti.com 5 Test Setup 5.1 Test Equipment DC Voltage Source: capable of 350 VDC to 400 VDC, adjustable, with minimum power rating of 400 W, or current rating not less than 1.5 A, with current limit function. The DC voltage source to be used should meet IEC61010 safety requirements. DC Multimeter: One unit capable of 0-VDC to 400-VDC input range, four digits display preferred; and one unit capable of 0-VDC to 15-VDC input range, four digits display preferred.
Test Setup www.ti.com Figure 6.
List of Test Points 6 www.ti.com List of Test Points Table 2.
Test Procedure www.ti.com 8 Test Procedure 8.1 Efficiency Measurement Procedure WARNING • Danger of electrical shock! High voltage present during the measurement. • Do not leave EVM powered when unattended. • Danger of heat burn from high temperature. 1. Refer to Figure 5 for basic set up to measure power conversion efficiency. The required equipment for this measurement is listed in Section 5.1. 2.
Performance Data and Typical Characteristic Curves 9 www.ti.com Performance Data and Typical Characteristic Curves Figure 7 through Figure 20 present typical performance curves for UCD3138LLCEVM-028. 9.1 Efficiency Efficiency 95.0% 90.0% 400Vdc 85.0% 380Vdc 350Vdc 80.0% 5 10 15 20 Load Current (A) 25 30 Figure 7. UCD3138LLCEVM-028 Efficiency 9.2 Load Regulation 12.300 Load Regulation (V) 12.100 11.900 11.700 400Vdc 380Vdc 11.500 350Vdc 11.
Performance Data and Typical Characteristic Curves www.ti.com 9.3 Switching Frequency Control 140.0 Switching Frequency (kHz) 400Vdc 380Vdc 120.0 350Vdc 100.0 80.0 60.0 40.0 5 10 15 20 Load Current (A) 25 30 Figure 9. Switching Frequency Control in LLC Mode 9.4 Load Operation with LLC and PWM Figure 10.
Performance Data and Typical Characteristic Curves 9.5 Very Light-Load Operation at High Line of Input Figure 12. PWM Control at 400VDC Input and Light Load (SR off) (Ch1 = VGS, Q7, Ch2 = VGS, Q6, Ch3 = VGS, SR1, Ch4 = VGS, SR2) 9.6 Figure 13. PWM Control with SR Off and Pulse Skipping (Ch1 = VGS, Q7, Ch2 = VGS, Q6, Ch3 = VGS, SR1, Ch4 = VGS, SR2) Output Voltage Ripple Figure 14. Output Voltage Ripple 380 VDC and Full Load 16 www.ti.
Performance Data and Typical Characteristic Curves www.ti.com 9.7 Output Turn On Figure 16. Output Turn On 380 VDC with Load Range 9.8 Figure 17. Output Turn On 350 VDC with Load Range Other Waveforms Figure 18.
Performance Data and Typical Characteristic Curves www.ti.com Gain - dB Gain and Phase verse Frequency 50.00 150.00 40.00 120.00 30.00 90.00 20.00 60.00 10.00 30.00 0.00 0.00 -10.00 -30.00 -20.00 -60.00 -30.00 -90.00 -40.00 -120.00 -50.00 0.10 -150.00 10.00 1.00 F - Frequency - kHz Gain Phase Figure 19. Control Loop Bode Plots at 380 VDC and Full Load Gain - dB Gain and Phase verse Frequency 50.00 150.00 40.00 120.00 30.00 90.00 20.00 60.00 10.00 30.00 0.00 0.00 -10.
EVM Assembly Drawing and PCB layout www.ti.com 10 EVM Assembly Drawing and PCB layout The following figures (Figure 21 through Figure 26) show the design of the UCD3138LLCEVM-028 printed circuit board. PCB dimensions: L x W = 8.0 inch x 6.0 inch, PCB material: FR4 or compatible, four layers and 2-ounce copper on each layer Figure 21. UCD3138LLCEVM-028 Top Layer Assembly Drawing (top view) Figure 22.
EVM Assembly Drawing and PCB layout www.ti.com Figure 23. UCD3138LLCEVM-028 Top Copper (top view) Figure 24.
EVM Assembly Drawing and PCB layout www.ti.com Figure 25. UCD3138LLCEVM-028 Internal Layer 2 (top view) Figure 26.
List of Materials 11 www.ti.com List of Materials Component list based on Figure 1 and Figure 2 Table 4. UCD3138LLCEVM-028 List of Materials QTY 22 REF DES DESCRIPTION PART NUMBER MFR 22 C1, C2, C4, C5, C6, Capacitor, ceramic, 16 V, X7R, 10%, 0.1 µF, 0603 C8, C11, C12, C21, C22, C23, C24, C25, C26, C27, C29, C32, C35, C45, C50, C52, C62 STD STD 0 C10, C48, C55 Capacitor, ceramic, 6.
List of Materials www.ti.com Table 4. UCD3138LLCEVM-028 List of Materials (continued) QTY REF DES DESCRIPTION PART NUMBER MFR 1 J6 Header, male 2 pin, 100-millimeter spacing, 0.100 inch x 2 inch PEC02SAAN Sullins 0 J7 Header, male 2 x 3 pin, 100-millimeter spacing, open, PEC03DAAN 0.20 inch x 0.30 inch Sullins 4 J8, J9, J11, J12 Terminal block, 2 pin, 15 A, 5.1 mm, 0.40 inch x 0.35 inch ED120/2DS OST 1 L1 Inductor, resonant, 33 µH, 20%, 26.6 mm x 34.
References www.ti.com Table 4. UCD3138LLCEVM-028 List of Materials (continued) QTY REF DES DESCRIPTION PART NUMBER MFR 1 U1 Module, 5W, auxiliary bias PS, PCB assembly, 1.200 inch x 2.200 inch PWR050 TI 0 U11 N+1 and Oring Power Rail Controller, open, TSSOP14 TPS2411PW TI 1 U2 High Input Voltage, Micropower, 3.2 µA at 80 mA LDO, 3.3 V, QFN-8 TPS715A33DRBR TI 1 U3 Presicion, Low Noise, Low Quiescent Current OpAmp, SOT23-5 OPA376AIDBVR TI 1 U4 Micro SMD Temperature Sensor, 2.
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
【Important Notice for Users of EVMs for RF Products in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.
EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
