Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
UCC38C43DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C44DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C44DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC38C45DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC38C45DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC28C40DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C40DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C41DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C41DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C42DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C42DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C43DGKR VSSOP DGK 8 2500 367.0 367.0 35.0
UCC28C43DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C44DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C44DR SOIC D 8 2500 340.5 338.1 20.6
UCC28C45DGKR VSSOP DGK 8 2500 366.0 364.0 50.0
UCC28C45DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2