Datasheet

UCC2897A
SLUS829D -- AUGUST 2008 -- REVISED JULY 2009
3
www.ti.com
ORDERING INFORMATION
PART
NUMBERS{
T
A
APPLICATION
AUX
OUTPUT
POLARITY
CYCLE-BY-
CYCLE CS
THRESHOLD
HICCUP
MODE CS
THRESHOLD
110-VHVJFET
START-UP
CIRCUIT
TSSOP--20
(PW)}
QFN--20
(RGP)}
°
C
t
°
C
D
C
/
D
C
P
C
l
V
V
Y
s
U
C
C
A
P
W
U
C
C
A
R
G
P
-- 4 0 °C to 125°C DC
/
DC P-Channel 0.5
V
0.75
V
Y
es UCC2897
A
PW UCC2897
A
RGP
The PW package is available taped and reeled. Add R suffix to device type (e.g. UCC2897APWR) to order quantities of 2,000 devices per
reel. Bulk quantities are 70 units per tube. The RGP package is available in two options of tape and reel. The RGPT is orderable in small
reels of 250 (e.g. UCC2897ARGPT); the RGPR contains 3000 pieces per reel (e.g. UCC2897ARGPR).
The TSSOP-20 (PW) and QFN-- 20 (RGP) package uses Pb-free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C
peak reflow temperature and compatible with either lead free or Sn/Pb soldering operations.
THERMAL RESISTANCE INFORMATION
PACKAGE THERMAL RESISTANCE
(1)
UNITS
T
S
S
O
P
(
P
W
)
θjc 36.6 to 35.0
°
C
/
W
TSSOP --20 (PW)
θja 108.4 to 147.0
°C
/
W
Q
F
N
(
R
G
P
)
θjc TBD
°
C
/
W
QFN--20 (RGP)
θja TBD
°C
/
W
(1)
Thermal resistance is measured in accordance with JEDEC JESD 51 test conditions and is useful for thermal performance comparison of
different packages. Performance in any specific use is a function of board l ayout, board construction, air flow and other parameters.
PIN ASSIGNMENTS
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VIN
N/C
RDEL
RON
ROFF
VREF
SYNC
GND
CS
RSLOPE
N/C
LINEOV
LINEUV
VDD
PVDD
OUT
AUX
PGND
SS/SD
FB
PW PACKAGE
(TOP VIEW)
RDEL
NC
VIN
NC
LINEOV
LINEUV
VDD
PVDD
OUT
AUX
CS
RSLOPE
FB
SS/SD
PGND
QFN PACKAGE
(BOTTOM VIEW)
20
19
18
17
16
6
7
8
9
10
RON
ROFF
VREF
SYNC
GND
15 14 13 12 11
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