Datasheet

UCC28070
www.ti.com SLUS794E –NOVEMBER 2007–REVISED APRIL 2011
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
RATING UNIT
Human Body Model (HBM) 2,000
V
Charged Device Model (CDM) 500
DISSIPATION RATINGS
THERMAL IMPEDANCE T
A
= 25°C POWER
PACKAGE T
A
= 85°C POWER RATING
JUNCTION-TO-AMBIENT RATING
20-Pin TSSOP 125 °C/Watt
(1)
and
(2)
800 mW
(1)
320 mW
(1)
20-Pin SOIC 95 °C/Watt
(1)
and
(2)
1050 mW
(1)
420 mW
(1)
(1) Thermal resistance is a strong function of board construction and layout. Air flow reduces thermal resistance. This number is only a
general guide.
(2) Thermal resistance calculated with a low-K methodology.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
VCC Input Voltage (from a low-impedance source) V
UVLO
+ 1 V 21 V
VREF Load Current 2 mA
VINAC Input Voltage Range 0 3
IMO Voltage Range 0 3.3 V
PKLMT, CSA, & CSB Voltage Range 0 3.6
RSYNTH Resistance (R
SYN
) 15 750
kΩ
RDM Resistance (R
RDM
) 30 330
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