Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
UCC28019
SLUS755B – APRIL 2007 – REVISED DECEMBER 2007
ORDERING INFORMATION
OPERATING TEMPERATURE
PART NUMBER PACKAGE
(1)
RANGE, T
A
UCC28019D SOIC 8-Pin (D) ead (Pb)-Free/Green
– 40 ° C to 125 ° C
Plastic DIP 8 Pin (P) Lead
UCC28019P
(Pb)-Free/Green
(1) SOIC (D) package is available taped and reeled by adding "R" suffix the the above part number, reeled quantities are 2500 devices per
reel.
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
VCC – 0.3 to 22
GATE – 0.3 to 16
Input voltage range V
VINS, VSENSE, VCOMP, ICOMP – 0.3 to 7
ISENSE – 24 to 7
Input current range VSENSE, ISENSE – 1 to 1 mA
Operating – 55 to 150
Junction temperature, T
J
Storage – 65 to 150 ° C
Lead temperature, T
SOL
Soldering, 10s 300 °
(1) Stresses beyond those listed under “ Absolute Maximum Ratings ” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those included under “ Recommended Operating
Conditions ” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
PACKAGE THERMAL IMPEDANCE T
A
= 25 ° C POWER RATING (W) T
A
= 85 ° C POWER RATING (W)
JUNCTION TO AMBIENT ( ° C/W)
SOIC-8 (D) 160 0.65 0.25
PDIP-8 (P) 110 1 0.36
(1) Tested per JEDEC EIA/JESD 51-1. Thermal resistance is a strong function of board construction and layout. Air flow reduces thermal
resistance. This number is only a general guide. See TI document SPRA953 Thermal Metrics.
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
VCC input voltage from a low-impedance source VCC
OFF(max)
+ 1 V 21 V
T
J
Operating junction temperature – 40 125 ° C
over operating free-air temperature range (unless otherwise noted)
PARAMETER RATING UNIT
Human Body Model (HBM) 2 kV
Charged Device Model (CDM) 500 V
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