Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
UCC28019A
SLUS828B – DECEMBER 2008 – REVISED APRIL 2009 .................................................................................................................................................. www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER PACKAGE OPERATING TEMPERATURE RANGE, T
A
UCC28019ADG4 SOIC 8-Pin (D) Lead (Pb)-Free/Green
(1)
-40 ° C to 125 ° C
UCC28019APG4 Plastic DIP 8-Pin (P) Lead (Pb)-Free/Green
(1) SOIC (D) package is available taped and reeled by adding “ R ” to the above part number. Reeled quantities are 2,500 devices per reel.
Over operating free-air temperature range unless otherwise noted. Unless noted, all voltages are with respect to GND.
Currents are positive into and negative out of the specified terminal.
PARAMETER VALUE UNIT
VCC, GATE -0.3 to 22
Input voltage range VINS, VSENSE, VCOMP, ICOMP -0.3 to 7 V
ISENSE -24 to 7
Input current range VSENSE, ISENSE -1 to 1 mA
Operating -55 to 150
Junction temperature, T
J
Storage -65 to 150 ° C
Lead temperature, T
SOL
Soldering, 10s 300
(1) Stresses beyond those listed under “ absolute maximum ratings ” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those included under “ recommended operating
conditions ” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
THERMAL IMPEDANCE, T
A
= 25 ° C, T
A
= 85 ° C,
PACKAGE
JUNCTION TO AMBIENT ( ° C/W) POWER RATING (W) POWER RATING (W)
SOIC-8 (D) 160 0.65 0.25
PDIP-8 (P) 110 1 0.36
(1) Tested per JEDEC EIA/JESD 51-1. Thermal resistance is a strong function of board construction and layout. Air flow will reduce thermal
resistance. This number is only a general guide. See TI document SPRA953 IC Thermal Metrics.
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
VCC input voltage from a low-impedance source VCC
OFF
+ 1 V 21 V
Operating junction temperature, T
J
-40 125 ° C
PARAMETER RATING UNIT
Human Body Model (HBM) 2 kV
Charged Device Model (CDM) 500 V
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