Datasheet

UCC27611
SLUSBA5B –DECEMBER 2012 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGED DEVICES
(1)
TEMPERATURE RANGE T
A
= T
J
WSON-6 (DRV)
-40°C to +140°C UCC27611DRV
(1) ) For more information about traditional and new thermal metrics, see IC Package Thermal Metrics application report, SPRA953.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
DD
Supply voltage range -0.3 to 20.0
OUTH -0.3 to VREF +0.3
V
OUTL -0.3V to VREF +0.3
VREF 6
I
out_DC
Continuous source current of OUTH/sink current of OUTL 0.3/0.6
A
Continuous source current of OUTH/sink current of OUTL (0.5
I
out_pulsed
4/8
µs),
IN+, IN- -0.3V to 20
HBM ESD, human body model 2000 V
CDM ESD, charged device model 500 (WSON)
T
J
Operating virtual junction temperature range -40 to 150
T
stg
Storage temperature range -65 to 150
°C
Lead temperature, soldering, 10 sec. 300
Lead temperature, reflow 260
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