Datasheet

UCC27611

www.ti.com

SLUSBA5B –DECEMBER 2012

Thermal Information

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal

characteristics of the package. In order for a gate driver to be useful over a particular temperature range the

package must allow for the efficient removal of the heat produced while keeping the junction temperature within

rated limits. The thermal metrics for the driver package is summarized in the Thermal Information section of the

datasheet. For detailed information regarding the thermal information table, please refer to the Application Note

from Texas Instruments entitled IC Package Thermal Metrics (Texas Instruments Literature Number SPRA953A).

UCC27611 Offered in WSON, 7-Pin Package (DRV)

6-pin package with exposed thermal pad. The thermal information table summarizes the thermal performance

metrics related to the two packages. θ

metric should be used for comparison of power dissipation between

different packages. Under identical power dissipation conditions, the DRS package will maintain a lower die

temperature than the D

. The ψ

and ψ

metrics should be used when estimating the die temperature during

actual application measurements.

The DRV is a better thermal package overall because it has the exposed thermal pad and is able to sink heat to

the PCB. The thermal pad in DRV package provides designers with an ability to create an excellent heat removal

sub-system from the vicinity of the device, thus helping to maintain a lower junction temperature. This pad should

be soldered to the copper on the printed circuit board directly underneath the device package. Then a printed

circuit board designed with thermal lands and thermal vias completes a very efficient heat removal subsystem. In

such a design, the heat is extracted from the semiconductor junction through the thermal pad, which is then

efficiently conducted away from the location of the device on the PCB through the thermal network. This helps to

maintain a lower board temperature near the vicinity of the device leading to an overall lower device junction

temperature.

NOTE

The exposed pad in DRV package is directly connected to the GND of the internal

circuitry. It is electrically and thermally connected to the device which is the ground of the

device. It is required to externally connect the exposed pad to GND in PCB layout.

Product Folder Links: UCC27611