Datasheet
UCC27531
UCC27533, UCC27536
UCC27537, UCC27538
www.ti.com
SLUSBA7D – DECEMBER 2012–REVISED APRIL 2013
THERMAL INFORMATION
UCC27533, UCC27531,
UCC27536, UCC27538
UCC27537
THERMAL METRIC UNITS
DBV DBV
(1)
5 PINS 6 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
178.3 178.3
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
109.7 109.7
θ
JB
Junction-to-board thermal resistance
(4)
28.3 28.3 °C/W
ψ
JT
Junction-to-top characterization parameter
(5)
14.7 14.7
ψ
JB
Junction-to-board characterization parameter
(6)
27.8 27.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Supply voltage range, VDD 10 18 32 V
Operating junction temperature range -40 140 °C
Input voltage, IN, IN+, IN-, IN1, IN2 -5 25
V
Enable, EN -5 25
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