Datasheet

UCC27531
UCC27533, UCC27536
UCC27537, UCC27538
SLUSBA7D – DECEMBER 2012–REVISED APRIL 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION(CONT.)
Leaving the input pin of driver open holds the output low. The logic behavior of the driver is shown in the
application diagram, timing diagram and input and output logic truth table.
Internal circuitry on VDD pin provides an under voltage lockout function that holds output low until VDD supply
voltage is within operating range.
The UCC2753x driver is offered in a 5-pin or 6-pin standard SOT-23 (DBV) package. The device operates over
wide temperature range of -40°C to 140°C.
ORDERING INFORMATION
(1)
OPERATING
PEAK CURRENT INPUT THRESHOLD
PART NUMBER PACKAGE
(2)
TEMPERATURE RANGE
(SOURCE AND SINK) LOGIC
T
A
UCC27531DBV SOT-23, 6-PIN 2.5 A and 5 A
UCC27533DBV SOT-23, 5-PIN 2.5-A/5-A
TTL/CMOS –Compatible
UCC27536DBV SOT-23, 5-PIN 2.5-A/2.5-A (low-voltage, independent -40°C to +140°C
of VDD bias voltage)
UCC27537DBV SOT-23, 5-PIN 2.5-A/5-A
UCC27538DBV SOT-23, 6-PIN 2.5-A/5-A
(1) DBV package uses Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to
be compatible with either lead free or Sn/Pb soldering operations.
(2) For the most up-to-date packaging information see the TI web site.
ABSOLUTE MAXIMUM RATINGS
(1)(2)(3)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage range, VDD -0.3 35
Continuous OUTH, OUTL, OUT -0.3 VDD +0.3 V
Pulse OUTH, OUTL, OUT (200 ns) -2 VDD +0.3
Continuous IN, EN, IN+, IN-, IN1,
-5 27
IN2
Pulse IN, EN, IN+, IN-, IN1, IN2 (1.5
-6.5 27
V
µs)
Human body model, HBM (ESD) 4000
Charged device model, CDM (ESD) 1000
Operating virtual junction temperature range, T
J
-40 150
Storage temperature range, T
stg
-65 150
°C
Soldering, 10 sec. 300
Lead temperature
Reflow 260
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See
Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
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Product Folder Links: UCC27531 UCC27533, UCC27536 UCC27537, UCC27538