Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- PRODUCT MATRIX
- DESCRIPTION (CONTINUED)
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- THERMAL INFORMATION
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- Introduction
- VDD and Under Voltage Lockout
- Operating Supply Current
- Input Stage
- Enable Function
- Output Stagean updated Output Stage section.
- Low Propagation Delays and Tightly Matched Outputs
- Drive Current and Power Dissipationupdated Drive Current and Power Dissipation section.
- Thermal Information
- PCB Layout
- REVISION HISTORY

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
UCC27523DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27523DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC27523DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27523DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27524DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27524DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC27524DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27524DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27525DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27525DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UCC27525DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27525DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27526DSDR SON DSD 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
UCC27526DSDT SON DSD 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 1