Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- PRODUCT MATRIX
- DESCRIPTION (CONTINUED)
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- THERMAL INFORMATION
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- Introduction
- VDD and Under Voltage Lockout
- Operating Supply Current
- Input Stage
- Enable Function
- Output Stagean updated Output Stage section.
- Low Propagation Delays and Tightly Matched Outputs
- Drive Current and Power Dissipationupdated Drive Current and Power Dissipation section.
- Thermal Information
- PCB Layout
- REVISION HISTORY
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC27523DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27523DR SOIC D 8 2500 367.0 367.0 35.0
UCC27523DSDR SON DSD 8 3000 367.0 367.0 35.0
UCC27523DSDT SON DSD 8 250 210.0 185.0 35.0
UCC27524DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27524DR SOIC D 8 2500 367.0 367.0 35.0
UCC27524DSDR SON DSD 8 3000 367.0 367.0 35.0
UCC27524DSDT SON DSD 8 250 210.0 185.0 35.0
UCC27525DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27525DR SOIC D 8 2500 367.0 367.0 35.0
UCC27525DSDR SON DSD 8 3000 367.0 367.0 35.0
UCC27525DSDT SON DSD 8 250 210.0 185.0 35.0
UCC27526DSDR SON DSD 8 3000 367.0 367.0 35.0
UCC27526DSDT SON DSD 8 250 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 2