Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- PRODUCT MATRIX
- DESCRIPTION (CONTINUED)
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- THERMAL INFORMATION
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- Introduction
- VDD and Under Voltage Lockout
- Operating Supply Current
- Input Stage
- Enable Function
- Output Stagean updated Output Stage section.
- Low Propagation Delays and Tightly Matched Outputs
- Drive Current and Power Dissipationupdated Drive Current and Power Dissipation section.
- Thermal Information
- PCB Layout
- REVISION HISTORY

8
10
12
14
16
18
−50 0 50 100 150
Temperature (°C)
Input to Output Propagation Delay (ns)
Turn−on
Turn−off
V
DD
= 12 V
C
LOAD
= 1.8 nF
G010
8
10
12
14
16
18
−50 0 50 100 150
Temperature (°C)
EN to Output Propagation Delay (ns)
EN to Output High
EN to Output Low
V
DD
= 12 V
C
LOAD
= 1.8 nF
G011
5
6
7
8
9
10
−50 0 50 100 150
Temperature (°C)
Rise Time (ns)
V
DD
= 12 V
C
LOAD
= 1.8 nF
G008
5
6
7
8
9
−50 0 50 100 150
Temperature (°C)
Fall Time (ns)
V
DD
= 12 V
C
LOAD
= 1.8 nF
G009
3
4
5
6
7
−50 0 50 100 150
Temperature (°C)
Output Pull−up Resistance (Ω)
V
DD
= 12 V
I
OUT
= −10 mA
G006
0.2
0.4
0.6
0.8
1
−50 0 50 100 150
Temperature (°C)
Output Pull−down Resistance (Ω)
V
DD
= 12 V
I
OUT
= 10 mA
G007
UCC27523, UCC27524, UCC27525, UCC27526
SLUSAQ3F –NOVEMBER 2011–REVISED MAY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
OUTPUT PULLUP RESISTANCE OUTPUT PULLDOWN RESISTANCE
vs vs
TEMPERATURE TEMPERATURE
Figure 16. Figure 17.
RISE TIME FALL TIME
vs vs
TEMPERATURE TEMPERATURE
Figure 18. Figure 19.
INPUT TO OUTPUT PROPAGATION DELAY EN TO OUTPUT PROPAGATION DELAY
vs vs
TEMPERATURE TEMPERATURE
Figure 20. Figure 21.
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Product Folder Links: UCC27523, UCC27524, UCC27525, UCC27526