Datasheet
Table Of Contents

UCC27517
UCC27516
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SLUSAY4C – MARCH 2012–REVISED MAY 2013
REVISION HISTORY
Changes from Revision B (June 2012) to Revision C Page
• Added 0.5 to beginning of P
SW
equation in Power Dissipation section ............................................................................... 18
Changes from Revision A (March 2012) to Revision B Page
• Added UCC27516 device. .................................................................................................................................................... 1
• Added UCC27516 ordering information. ............................................................................................................................... 2
• Added DC and repetitive pulse rates to OUT voltage. ......................................................................................................... 3
• Changed Human Body Model max value from 2000 V to 400V. .......................................................................................... 3
• Changed Charged Device Model max value from 500 V to 100 V. ...................................................................................... 3
• Added note 5. ....................................................................................................................................................................... 3
• Added UCC27516 block diagram. ........................................................................................................................................ 7
• Added GND, ground definition. ............................................................................................................................................. 8
• Deleted note one from selection. ........................................................................................................................................ 12
• Added UCC27516 application diagrams. ............................................................................................................................ 13
• Added Thermal Information description. ............................................................................................................................. 19
• Added PCB layout bullet. .................................................................................................................................................... 20
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