Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC27423QDGNRQ1 MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
UCC27423QDRQ1 SOIC D 8 2500 340.5 338.1 20.6
UCC27424QDGNRQ1 MSOP-PowerPAD DGN 8 2500 367.0 367.0 35.0
UCC27424QDRQ1 SOIC D 8 2500 340.5 338.1 20.6
UCC27425QDRQ1 SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Mar-2013
Pack Materials-Page 2