Datasheet
D, DGN, OR P PACKAGE
(TOP VIEW)
D, DGN, OR P PACKAGE
(TOP VIEW)
D, DGN, OR P PACKAGE
(TOP VIEW)
ENBA
INA
GND
INB
ENBB
OUTA
VDD
OUTB
8
7
6
5
1
2
3
4
ENBA
INA
GND
INB
ENBB
OUTA
VDD
OUTB
8
7
6
5
1
2
3
4
ENBA
INA
GND
INB
ENBB
OUTA
VDD
OUTB
8
7
6
5
1
2
3
4
(DUAL INVERTING) (DUAL NON-INVERTING) (ONE INVERTING AND
ONE NON-INVERTING)
UCC27423
UCC27424
UCC27425
UCC27423, UCC27424, UCC27425
SLUS545D –NOVEMBER 2002–REVISED MAY 2013
www.ti.com
ORDERING INFORMATION
PACKAGED DEVICES
OUTPUT TEMPERATURE RANGE
SOIC-8 MSOP-8 PowerPAD PDIP-8
CONFIGURATION T
A
= T
J
(D)
(1)
(DGN)
(2)
(P)
Dual inverting –40°C to 125°C UCC27423D UCC27423DGN UCC27423P
Dual nonInverting –40°C to 125°C UCC27424D UCC27424DGN UCC27424P
One inverting, one
–40°C to 125°C UCC27425D UCC27425DGN UCC27425P
noninverting
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27423DR,
UCC27424DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the
substrate which is the ground of the device.
POWER DISSIPATION RATING TABLE
DERATING FACTOR
POWER RATING (mW)
PACKAGE SUFFIX θ
JC
(°C/W) θ
JA
(°C/W) ABOVE
T
A
= 70°C
(1)
70°C (mW/°C)
(1)
SOIC-8 D 42 84 - 160‡ 344–655
(2)
6.25–11.9
(2)
PDIP-8 P 49 110 500 9
MSOP PowerPAD-8
(3)
DGN 4.7 50 - 59‡ 1370 17.1
(1) 125°C operating junction temperature is used for power rating calculations
(2) The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best
and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order
to spread the heat away form the device more effectively. For information on the PowerPAD™ package, refer to Technical Brief,
PowerPad Thermally Enhanced Package, Texas Instruments (SLMA002) and Application Brief, PowerPad Made Easy, Texas
Instruments (SLMA004).
(3) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the
substrate which is the ground of the device.
Table 1. Input/Output Table
INPUTS (VIN_L, VIN_H) UCC27423 UCC27424 UCC27425
ENBA ENBB INA INB OUTA OUTB OUTA OUTB OUTA OUTB
H H L L H H L L H L
H H L H H L L H H H
H H H L L H H L L L
H H H H L L H H L H
L L X X L L L L L L
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Product Folder Links: UCC27423 UCC27424 UCC27425