Datasheet

UCC27323-Q1, UCC27324-Q1, UCC27325-Q1
SLUS678A –MARCH 2008–REVISED APRIL 2012 www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
V
DD
Supply voltage –0.3 V to 16 V
DC, I
OUT_DC
0.3 A
I
O
Output current (OUTA, OUTB)
Pulsed (0.5 μs), I
OUT_PULSED
4.5 A
DGN package 3 W
P
D
Power dissipation at T
A
= 25°C D package 650 mW
P package 350 mW
T
J
Junction operating temperature –55°C to 150°C
T
stg
Storage temperature –65°C to 150°C
T
lead
Lead temperature Soldering, 10 s 300°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into and negative out of the specified terminal.
POWER DISSIPATION RATINGS
POWER RATING
(1)
DERATING FACTOR
(1)
PACKAGE θ
JC
(°C/W) θ
JA
(°C/W) T
A
= 70°C T
A
> 70°C
(mW) (mW/°C)
D (SOIC-8) 42 84 to 160
(2)
344 to 655
(2)
6.25 to 11.9
(2)
P (PDIP-8) 49 110 500 9
DGN (MSOP-8
4.7 50 to 59
(2)
1370
(4)
17.1
(4)
PowerPAD)
(3)
(1) 125°C operating junction temperature is used for power rating calculations.
(2) The range of values indicates the effect of the PC board. These values are intended to give the system designer an indication of the
best and worst case conditions. In general, the system designer should attempt to use larger traces on the PC board where possible to
spread the heat away form the device more effectively. For information on the PowerPAD package, see the technical brief, PowerPad™
Thermally Enhanced Package, Texas Instruments literature number SLMA002 and the application brief, PowerPad™ Made Easy, Texas
Instruments literature number SLMA004.
(3) The PowerPAD thermal pad is not directly connected to any leads of the package. However, it is electrically and thermally connected to
the substrate, which is the ground of the device.
(4) 150°C operating junction temperature is used for power rating calculations.
OVERALL ELECTRICAL CHARACTERISTICS
V
CC
= 4.5 V to 15 V, T
A
= –40°C to 125°C (unless otherwise noted), T
A
= T
J
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INB = 0 V 300 450
INA = 0 V
INB = HIGH 300 450
UCC27323
INB = 0 V 300 450
INA = HIGH
INB = HIGH 300 450
INB = 0 V 2 80
INA = 0 V
INB = HIGH 300 450
I
DD
Static operating current UCC27324 μA
INB = 0 V 300 450
INA = HIGH
INB = HIGH 600 800
INB = 0 V 150 300
INA = 0 V
INB = HIGH 450 600
UCC27325
INB = 0 V 150 300
INA = HIGH
INB = HIGH 450 600
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