Datasheet

UCC27323-Q1, UCC27324-Q1, UCC27325-Q1

www.ti.com

SLUS678A –MARCH 2008–REVISED APRIL 2012

NOTE

The PowerPAD thermal pad is not directly connected to any leads of the package.

However, it is electrically and thermally connected to the substrate, which is the ground of

the device.

References

1. Power Supply Seminar SEM-1400 Topic 2: Design And Application Guide For High Speed MOSFET Gate

Drive Circuits, Laszlo Balogh (SLUP133)

2. Practical Considerations in High Performance MOSFET, IGBT and MCT Gate Drive Circuits, Bill Andreycak

(SLUA105)

3. PowerPad Thermally Enhanced Package (SLMA002)

4. PowerPAD Made Easy (SLMA004)