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ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Non-inverting Low side PDIP 8
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Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Power
PAD
UCC37325DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC27323DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27323DR SOIC D 8 2500 340.5 338.1 20.6
UCC27324DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27324DR SOIC D 8 2500 340.5 338.1 20.6
UCC27325DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC27325DR SOIC D 8 2500 340.5 338.1 20.6
UCC37323DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC37323DR SOIC D 8 2500 340.5 338.1 20.6
UCC37324DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC37324DR SOIC D 8 2500 340.5 338.1 20.6
UCC37325DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
UCC37325DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2