Datasheet
UCC27323, UCC27324, UCC27325
UCC37323, UCC37324, UCC37325
SLUS492H –JUNE 2001–REVISED MAY 2013
www.ti.com
D, DGN, OR P PACKAGE
(TOP VIEW)
ORDERING INFORMATION
(1)
OUTPUT CONFIGURATION TEMPERATURE PACKAGED DEVICES
RANGE
SOIC-8 (D) MSOP-8 PowerPAD PDIP-8 (P)
T
A
= T
J
(DGN)
(2)
Dual inverting –40°C to +125°C UCC27323D UCC27323DGN UCC27323P
0°C to +70°C UCC37323D UCC37323DGN UCC37323P
Dual nonInverting –40°C to +125°C UCC27324D UCC27324DGN UCC27324P
0°C to +70°C UCC37324D UCC37324DGN UCC37324P
One inverting, one noninverting –40°C to +125°C UCC27325D UCC27325DGN UCC27325P
0°C to +70°C UCC37325D UCC37325DGN UCC37325P
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (for example
UCC27323DR, UCC27324DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD is not directly connected to any leads of the package. However, the PowerPAD is electrically and thermally connected to
the substrate which is the ground of the device.
POWER DISSIPATION RATINGS
PACKAGE SUFFIX θ
JC
(°C/W) θ
JA
(°C/W) Power Rating (mW) Derating Factor
T
A
= 70°C
(1)
Above 70°C
(mW/°C)
(1)
SOIC-8 D 42 84 to 160
(2)
344 to 655
(3)
6.25 to 11.9
(3)
PDIP-8 P 49 110 500 9
MSOP PowerPAD-8
(2)
DGN 4.7 50 to 59
(2)
1370 17.1
(1) 125°C operating junction temperature is used for power rating calculations.
(2) The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate
which is the ground of the device.
(3) The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best
and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order
to spread the heat away form the device more effectively. For information on the PowerPAD package, refer to Technical Brief,
PowerPad Thermally Enhanced Package, Texas Instrument's Literature Number SLMA002, and Application Brief, PowerPad Made
Easy, Texas Instruments Literature Number SLMA004.
Table 1. INPUT/OUTPUT TABLE
INPUTS (VIN_L, VIN_H) UCC37323 UCC37324 UCC37325
INA INB OUTA OUTB OUTA OUTB OUTA OUTB
L L H H L L H L
L H H L L H H H
H L L H H L L L
H H L L H H L H
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