Datasheet

UCC27321-Q1, UCC27322-Q1
www.ti.com SLUSA13C –FEBRUARY 2010–REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS
(1) (2)
over operating free-air temperature range (unless otherwise noted)
V
DD
Supply voltage –0.3 V to 16 V
I
O
Output current, OUT 0.6 A
–5 V to 6 V or V
DD
+ 0.3 V
IN
(whichever is larger)
V
I
Input voltage
–5 V to 6 V or V
DD
+ 0.3 V
ENBL
(whichever is larger)
D package 650 mW
P
D
Power dissipation at T
A
= 25°C
DGN package 3 W
T
J
Junction operating temperature –55°C to 150°C
T
stg
Storage temperature –65°C to 150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into and negative out of the specified terminal.
POWER DISSIPATION RATINGS
POWER RATING
(1)
DERATING FACTOR
(1)
PACKAGE θ
JC
(°C/W) θ
JA
(°C/W) T
A
= 70°C T
A
> 70°C
(mW) (mW/°C)
D (SOIC-8) 42 84 to 160
(2)
344 to 655
(2)
6.25 to 11.9
(2)
DGN (MSOP-8
4.7 50 to 59
(2)
1370 17.1
PowerPAD)
(3)
(1) 125°C operating junction temperature is used for power rating calculations.
(2) The range of values indicates the effect of the PCB. These values are intended to give the system designer an indication of the best-
and worst-case conditions. In general, the system designer should attempt to use larger traces on the PC board where possible to
spread the heat away form the device more effectively. For information on the PowerPAD package, see the technical brief, PowerPad™
Thermally Enhanced Package, Texas Instruments literature number SLMA002 and the application brief, PowerPad™ Made Easy, Texas
Instruments literature number SLMA004.
(3) The PowerPAD thermal pad is not directly connected to any leads of the package. However, it is electrically and thermally connected to
the substrate, which is the ground of the device.
OVERALL ELECTRICAL CHARACTERISTICS
V
DD
= 4.5 V to 15 V, T
J
= T
A
= –40°C to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
150 225
IN = Low, ENBL = Low, V
DD
= 15 V
440 650
UCC27321
370 550
IN = High, ENBL = Low, V
DD
= 15 V
370 550
I
DD
Static operating current µA
150 225
IN = Low, ENBL = High, V
DD
= 15 V
450 650
UCC27322
75 125
IN = High, ENBL = High, V
DD
= 15 V
675 1000
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