Datasheet

UCC27210

UCC27211

www.ti.com

SLUSAT7E –NOVEMBER 2011–REVISED AUGUST 2013

TERMINAL FUNCTIONS

PIN NAME DESCRIPTION

D/DDA/DRM DPR

Positive supply to the lower-gate driver. De-couple this pin to V

(GND). Typical

VDD 1 1

decoupling capacitor range is 0.22 µF to 4.7 µF (See

(1)

High-side bootstrap supply. The bootstrap diode is on-chip but the external bootstrap

capacitor is required. Connect positive side of the bootstrap capacitor to this pin.

HB 2 2 Typical range of HB bypass capacitor is 0.022 µF to 0.1 µF. The capacitor value is

dependant on the gate charge of the high-side MOSFET and should also be selected

based on speed and ripple criteria

HO 3 3 High-side output. Connect to the gate of the high-side power MOSFET.

High-side source connection. Connect to source of high-side power MOSFET.

HS 4 4

Connect the negative side of bootstrap capacitor to this pin.

HI 5 7 High-side input.

(2)

LI 6 8 Low-side input.

(2)

VSS 7 9 Negative supply terminal for the device which is generally grounded.

LO 8 10 Low-side output. Connect to the gate of the low-side power MOSFET.

N/C - 5/6 Not Connected.

Utilized on the DDA, DRM and DPR packages only. Electrically referenced to V

PowerPAD™

(3)

Pad Pad (GND). Connect to a large thermal mass trace or GND plane to dramatically improve

thermal performance.

(1) For cold temperature applications we recommend the upper capacitance range. Attention should also be made to PCB layout - see

Layout Recommendations.

(2) HI or LI input is assumed to connect to a low impedance source signal. The source output impedance is assumed less than 100 Ω. If the

source impedance is greater than 100 Ω, add a bypassing capacitor, each, between HI and VSS and between LI and VSS. The added

capacitor value depends on the noise levels presented on the pins, typically from 1 nF to 10 nF should be effective to eliminate the

possible noise effect. When noise is present on two pins, HI or LI, the effect is to cause HO and LO malfunctions to have wrong logic

outputs.

(3) The PowerPAD™ is not directly connected to any leads of the package. However it is electrically and thermally connected to the

substrate which is the ground of the device.

Product Folder Links: UCC27210 UCC27211