Datasheet

UCC27210

UCC27211

SLUSAT7E –NOVEMBER 2011 –REVISED AUGUST 2013

www.ti.com

Layout Recommendations

To improve the switching characteristics and efficiency of a design, the following layout rules should be followed.

• Locate the driver as close as possible to the MOSFETs.

• Locate the V

-V

and V

-V

(bootstrap) capacitors as close as possible to the device (see example

layout below).

• Pay close attention to the GND trace. Use the thermal pad of the DDA and DRM package as GND by

connecting it to the VSS pin (GND). The GND trace from the driver goes directly to the source of the

MOSFET but should not be in the high current path of the MOSFET(S) drain or source current.

• Use similar rules for the HS node as for GND for the high-side driver.

• For systems using multiple UCC27210 and UCC27211 devices we recommend that dedicated decoupling

capacitors be located at V

-V

for each device.

• Care should be taken to avoid VDD traces being close to LO, HS, and HO signals.

• Use wide traces for LO and HO closely following the associated GND or HS traces. 60 to 100-mils width is

preferable where possible.

• Use as least two or more vias if the driver outputs or SW node needs to be routed from one layer to another.

For GND the number of vias needs to be a consideration of the thermal pad requirements as well as parasitic

inductance.

• Avoid LI and HI (driver input) going close to the HS node or any other high dV/dT traces that can induce

significant noise into the relatively high impedance leads.

Keep in mind that a poor layout can cause a significant drop in efficiency or system malfunction versus a good

PCB layout and can even lead to decreased reliability of the whole system.

Example Component Placement

Figure 21. UCC27210/11 Component Placement

Additional References

These references and links to additional information may be found at www.ti.com

• Additional layout guidelines for PCB land patterns may be found in, QFN/SON PCB Attachment, Application

Brief (Texas Instrument's Literature Number SLUA271)

• Additional thermal performance guidelines may be found in, PowerPAD™ Thermally Enhanced Package

Application Report, Application Report (Texas Instrument's Literature Number SLMA002A)

• Additional thermal performance guidelines may be found in, PowerPAD™ Made Easy, Application Report

(Texas Instrument's Literature Number SLMA004)

Product Folder Links: UCC27210 UCC27211