Datasheet

RECOMMENDED OPERATING CONDITIONS
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
THERMAL CHARACTERISTICS
UCC27200 , UCC27201
www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
V
DD
Supply voltage range 8 12 17
V
HS
Voltage on HS -1 105
V
Voltage on HS, (repetitive pulse < 100 ns) -5 110
V
HB
V
HS
+ 8, V
HS
+ 17,
Voltage on HB
V
DD
– 1 115
Voltage slew rate on HS 50 V / ns
T
J
Operating junction temperature range -40 +140 ° C
METHOD MIN UNIT
Human body model 2000
V
CDM 1000
over operating free-air temperature range, maximum power dissipation at ambient temperature: P
DISS
= (150-T
A
) / θ
JA
, (unless
otherwise noted)
θ
JA
( ° C/W)(Junction to θ
JP
( ° C/W) ( Junction to
PACKAGE θ
JC
( ° C/W)( Junction to Case)
Ambient) PowerPad™)
D 95 71 NA
DDA
(1)
46 71 4.8
DRM
(2)
38 56 4.1
(1) Test board conditions:
a. 3in x 3in, four4 layers, thickness: 0.062 in.
b. 2-oz copper traces located on the top and bottom of the PCB.
c. 2-oz copper ground planes on the internal 2 layers.
d. Six thermal vias in the PowerPad™ area under the device package.
(2) Test board conditions:
a. 3in x 3in, 4 layers, thickness: 0.062 in.
b. 2-oz copper traces located on the top and bottom of the PCB.
c. 2-oz copper ground planes on the internal 2 layers.
d. Four thermal vias in the PowerPad™ area under the device package.
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