Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - gate drivers Non-inverting High AND low side, Autonomous SO 8 PowerPad

FEATURES

CONTENTS

DESCRIPTION

APPLICATIONS

Simplified Application Diagram

PWM

CONTROLLER

+12V

ISOLATION

AND

FEEDBACK

+100V

SECONDARY

SIDE

CIRCUIT

CONTROL

DRIVE

UCC27200/1

UCC27200 , UCC27201

www.ti.com

....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008

120-V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver

• Specified from -40 ° C to 140 ° C

• Drives Two N-Channel MOSFETs in

Device Ratings 2

High-Side/Low-Side Configuration

Electrical Characteristics 4

• Maximum Boot Voltage 120 V

Device Information 11

• Maximum VDD Voltage 20 V

• On-Chip 0.65-V VF, 0.6- Ω RD Bootstrap Diode

Application Information 14

• Greater than 1 MHz of Operation

Additional References 22

• 20-ns Propagation Delay Times

• 3-A Sink, 3-A Source Output Currents

• 8-ns Rise/7-ns Fall Time with 1000-pF Load

The UCC27200/1 family of high frequency N-Channel

• 1-ns Delay Matching

MOSFET drivers include a 120-V bootstrap diode and

high-side/low-side driver with independent inputs for

• Under Voltage Lockout for High-Side and

maximum control flexibility. This allows for N-Channel

Low-Side Driver

MOSFET control in half-bridge, full-bridge, two-switch

forward and active clamp forward converters. The

low-side and the high-side gate drivers are

• Power Supplies for Telecom, Datacom, and

independently controlled and matched to 1-ns

Merchant Markets

between the turn-on and turn-off of each other.

• Half-Bridge Applications and Full-Bridge

Converters

• Isolated Bus Architecture

• Two-Switch Forward Converters

• Active-Clamp Forward Converters

• High Voltage Synchronous-Buck Converters

• Class-D Audio Amplifiers

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 PowerPad is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (34 pages)

PAGE 1
UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 120-V Boot, 3-A Peak, High Frequency, High-Side/Low-Side Driver FEATURES 1 CONTENTS • Specified from -40 °C to 140 °C • Drives Two N-Channel MOSFETs in High-Side/Low-Side Configuration • Maximum Boot Voltage 120 V • Maximum VDD Voltage 20 V • On-Chip 0.65-V VF, 0.
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com DESCRIPTION (CONT.) An on-chip bootstrap diode eliminates the external discrete diodes. Under-voltage lockout is provided for both the high-side and the low-side drivers forcing the outputs low if the drive voltage is below the specified threshold. Two versions of the UCC27200 are offered.
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UCC27200, UCC27201 www.ti.com .......................................................................................................................................
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range, VDD = VHB = 12 V, VHS = VSS = 0 V, No load on LO or HO, TA = TJ = -40°C to +140°C, (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Supply Currents IDD VDD quiescent current VLI = VHI = 0 0.4 0.
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UCC27200, UCC27201 www.ti.com .......................................................................................................................................
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS UCC27200 IDD OPERATING CURRENT vs FREQUENCY UCC27201 IDD OPERATING CURRENT vs FREQUENCY 10.0 10.0 VDD = 12 V No Load on Outputs VDD = 12 V No Load on Outputs 150oC IDDO - Operating Current - mA IDDO - Operating Current - mA 25oC 150oC 125oC 1.0 25oC o -40 C 0.
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UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 TYPICAL CHARACTERISTICS (continued) UCC27200 INPUT THRESHOLD vs SUPPLY VOLTAGE UCC27201 INPUT THRESHOLD vs SUPPLY VOLTAGE 2.0 T = 25oC T = 25oC HI, LI - Input Threshold Voltage - V HI, LI - Input Threshold Voltage/VDD Voltage - % 50 Rising 48 46 Falling 44 42 1.8 Rising Falling 1.
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) LO AND HO HIGH LEVEL OUTPUT VOLTAGE vs TEMPERATURE LO AND HO LOW LEVEL OUTPUT VOLTAGE vs TEMPERATURE 0.45 0.45 VDD = VHB = 16 V ILO = IHO = -100 mA 0.35 VDD = VHB = 12 V 0.30 VDD = VHB = 8 V 0.25 0.20 0.15 0.10 ILO = IHO = 100 mA 0.
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UCC27200, UCC27201 www.ti.com .......................................................................................................................................
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) DELAY MATCHING vs TEMPERATURE OUTPUT CURRENT vs OUTPUT VOLTAGE 3.5 7 VDD = VHB = 12 V VDD = VHB = 12 V 3.0 Delay Matching - ns 5 4 UCC27200TMOFF 3 UCC27201TMOFF UCC27201TMON UCC27200TMON 2 ILO, IHO - Output Current - A 6 2.
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UCC27200, UCC27201 www.ti.com .......................................................................................................................................
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com TERMINAL FUNCTIONS TERMINAL NAME NO. VDD 1 I/O DESCRIPTION I Positive supply to the lower gate driver. De-couple this pin to VSS (GND). Typical decoupling capacitor range is 0.22 µF to 1.0 µF. HB 2 I High-side bootstrap supply.
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UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 FUNCTIONAL BLOCK DIAGRAM 2 HB 3 HO 4 HS 8 LO 7 VSS UVLO LEVEL SHIFT HI 5 VDD 1 UVLO LI 6 Figure 21. TIMING DIAGRAMS LI Input (HI, LI) HI TDLRR, TDHRR LO Output (HO, LO) TDLFF, TDHFF HO TMON TMOFF Figure 22.
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UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com APPLICATION INFORMATION Functional Description The UCC27200 and UCC27201 are high-side/low-side drivers. The high-side and low-side each have independent inputs which allow maximum flexibility of input control signals in the application.
PAGE 15
UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 Design Tips Switching the MOSFETs Achieving optimum drive performance at high frequency efficiently requires special attention to layout and minimizing parasitic inductances.
PAGE 16
UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com The ISOURCE current charges the CGS gate capacitor and the ISINK current discharges it. The rise and fall time of the voltage across the gate to source defines how quickly the MOSFET can be switched.
PAGE 17
UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 Turning off the MOSFET needs to be achieved as fast as possible to minimize switching losses. For this reason the UCC2720x drivers are designed for high peak currents and low output resistance. The sink capability is specified as 0.18 V at 100-mA dc current implying 1.8-Ω RDS(on).
PAGE 18
UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com Dynamic Switching of the MOSFETs The true behavior of MOSFETS presents a dynamic capacitive load primarily at the gate to source threshold voltage.
PAGE 19
UCC27200, UCC27201 + + + www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 Figure 30.
PAGE 20
UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com Delay Matching and Narrow Pulse Widths The total delays encountered in the PWM, driver and power stage need to be considered for a number of reasons, primarily delay in current limit response.
PAGE 21
UCC27200, UCC27201 www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 Boot Diode Performance The UCC2720x family of drivers incorporates the bootstrap diode necessary to generate the high side bias internally. The characteristics of this diode are important to achieve efficient, reliable operation. The dc characteristics to consider are VF and dynamic resistance.
PAGE 22
UCC27200, UCC27201 SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008 ....................................................................................................................................... www.ti.com Figure 35. Example Component Placement Additional References These references and links to additional information may be found at www.ti.com. 1. Additional layout guidelines for PCB land patterns may be found in Application Brief SLUA271 2.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 7-Feb-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UCC27200DDAR SO Power PAD DDA 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 UCC27200DDAR SO Power PAD DDA 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 UCC27200DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 7-Feb-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC27200DDAR SO PowerPAD DDA 8 2500 367.0 367.0 35.0 UCC27200DDAR SO PowerPAD DDA 8 2500 364.0 364.0 27.0 UCC27200DR SOIC D 8 2500 340.5 338.1 20.6 UCC27200DRMR VSON DRM 8 3000 367.0 367.0 35.0 UCC27200DRMT VSON DRM 8 250 210.0 185.0 35.0 UCC27201DDAR SO PowerPAD DDA 8 2500 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.