Datasheet

1
2
3
4
8
7
6
5
VDD
HB
HO
HS
LO
VSS
LI
HI
SOIC-8(D)
TOP VIEW
1
2
3
4
8
7
6
5
VDD
HB
HO
HS
VSS
Power Pad
TM
SOIC-8(DDA)
TOP VIEW
Exposed
Thermal
Die Pad
LO
LI
HI
1
2
3
4
9
7
6
5
VDD
HB
HO
HS
VSS
SON-9 (DRC)
TOP VIEW
Exposed
Thermal
Die Pad*
LO
LI
HI
8
N/C
1
2
3
4
8
7
6
5
VDD
HB
HO
HS
VSS
SON-8 (DRM)
TOP VIEW
Exposed
Thermal
Die Pad*
LO
LI
HI
Exposed
Thermal
Die Pad
SON-10 (DPR)
TOP VIEW
NC
LO
VSS
LI
HI
NC
VDD
10
HO
HS
HB
8
7
6
9
1
3
4
5
2
UCC27200A, UCC27201A
www.ti.com SLUSAF9A –FEBRUARY 2011– REVISED DECEMBER 2011
DEVICE INFORMATION
NOTE
Pin VSS and the exposed thermal die pad are internally connected.
Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): UCC27200A UCC27201A