Datasheet

UCC27200A, UCC27201A
SLUSAF9A –FEBRUARY 2011– REVISED DECEMBER 2011 www.ti.com
THERMAL INFORMATION
UCC27200A UCC27200A UCC27200A
/UCC27201A /UCC27201A /UCC27201A
THERMAL METRIC
(1) (2)
UNITS
DRM DRC DPR
8 PINS 9 PINS 10 PINS
θ
JA
Junction-to-ambient thermal resistance 36.2 43.7 34.8
θ
JCtop
Junction-to-case (top) thermal resistance 41.6 49.9 32.1
θ
JB
Junction-to-board thermal resistance 13.2 19.1 11.9
°C/W
ψ
JT
Junction-to-top characterization parameter 0.6 0.6 0.2
ψ
JB
Junction-to-board characterization parameter 13.4 19.3 12.2
θ
JCbot
Junction-to-case (bottom) thermal resistance 3.1 3.8 1.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
THERMAL INFORMATION
UCC27200A UCC27200A
/UCC27201A /UCC27201A
THERMAL METRIC
(1)(2)
UNITS
D DDA
8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 106.5 40.5
θ
JCtop
Junction-to-case (top) thermal resistance 52.9 49.0
θ
JB
Junction-to-board thermal resistance 46.6 10.2
°C/W
ψ
JT
Junction-to-top characterization parameter 9.6 3.1
ψ
JB
Junction-to-board characterization parameter 46.1 9.7
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a 1.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
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