Datasheet

DEVICE INFORMATION
1
2
3
4
8
7
6
5
VDD
HB
HO
HS
LO
VSS
LI
HI
SOIC-8(D)
TOP VIEW
1
2
3
4
8
7
6
5
VDD
HB
HO
HS
VSS
Power Pad
TM
SOIC-8(DDA)
TOP VIEW
Exposed
Thermal
Die Pad
LO
LI
HI
1
2
3
4
8
7
6
5
VDD
HB
HO
HS
VSS
SON-8 (DRM)
TOP VIEW
Exposed
Thermal
Die Pad*
LO
LI
HI
UCC27200 , UCC27201
www.ti.com ....................................................................................................................................... SLUS746B – DECEMBER 2006 – REVISED NOVEMBER 2008
NOTE:
Pin VSS and the exposed thermal die pad are internally connected.
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Product Folder Link(s): UCC27200 UCC27201