Datasheet

UCC25600
SLUS846B –SEPTEMBER 2008– REVISED JULY 2011 www.ti.com
ORDERING INFORMATION
PART NUMBER PACKAGE OPERATING TEMPERATURE
UCC25600D 8-Pin SOIC -40°C to 125°C
ABSOLUTE MAXIMUM RATINGS
(1) (2) (3) (4)
over operating free-air temperature range (unless otherwise noted)
PARAMETER LIMIT UNIT
Supply voltage, VCC 22
V
Voltage, GD1, GD2 -0.5 to VCC + 0.5
Gate drive current – continuous, GD1, GD2 +/- 25
Current, RT -5 mA
Current, DT -0.7
Operating junction temperature, T
J
−40 to 125
Storage temperature, T
STG
−65 to 150 °C
Lead temperature (10 seconds) 260
(1) These are stress limits. Stress beyond these limits may cause permanent damage to the device. Functional operation of the device at
these or any conditions beyond those indicated under RECOMMENDED OPERATING CONDITIONS is not implied. Exposure to
absolute maximum rated conditions for extended periods of time may affect device reliability.
(2) All voltages are with respect to GND.
(3) All currents are positive into the terminal, negative out of the terminal.
(4) In normal use, terminals GD1 and GD2 are connected to an external gate driver and are internally limited in output current.
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
PARAMETER RATING UNIT
Human Body Model (HBM) 2,000
V
Charged Device Model (CDM) 500
DISSIPATION RATINGS
THERMAL IMPEDANCE,
PACKAGE T
A
= 25°C POWER RATING T
A
= 85°C POWER RATING
JUNCTION-TO-AMBIENT
8-Pin SOIC 150°C/watt
(1) (2)
667 mW
(1)
267 mW
(1)
(1) Thermal resistance is a strong function of board construction and layout. Air flow will reduce thermal resistance. This number is only a
general guide.
(2) Thermal resistance calculated with a low-K methodology.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER MINIMUM MAXIMUM UNIT
VCC input voltage from a low-impedance source 11.5 18.0 V
RT resistance 1 8.666
kΩ
DT resistance 3.3 39
SS capacitor 0.01 1 μF
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