Using the UCC25230EVM-662 User's Guide Literature Number: SLUU863 February 2012
User's Guide SLUU863 – February 2012 Biased Half-Bridge Converter with UCC28250 Secondary-Side Control for 48-V Telecom Applications 1 Introduction This EVM is used to evaluate bias power supply with UCC25230 used in the UCC28250, based on a secondary-side controlled, half-bridge DC-to-DC converter. The UCC25230EVM-662 is actually a combination of two released EVMs, UCC28250EVM-564 and UCC25230EVM-754. The UCC28250EVM-564 is an EVM of secondary-side controlled symmetrical half-bridge DC-to-DC converter.
Electrical Performance Specifications www.ti.com 3 Electrical Performance Specifications Table 1. UCC25230EVM-662 Electrical Performance Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Input Characteristics Voltage range 36 48 72 V Maximum input current VIN = 36 V and IOUT = 30 A 3.5 A No load input current VIN = 72 V 90 mA Output Characteristics Output voltage, VOUT Output current = 0 A 3.25 3.
Schematic Schematic + 4 www.ti.com Figure 1.
Test Setup www.ti.com 5 Test Setup 5.1 Test Equipment Voltage Source: HP 6015A DC power supply, or equivalent to provide 36 VDC to 72 VDC, and minimum 3.5 A. Multimeters: Fluke 45 dual display multimeter, or equivalent. Output Load: HPA 6060A DC electronic load, or equivalent capable of 3.3 V and 30 A. Oscilloscope: A 20-MHz or equivalent analog or digital oscilloscope. Recommended Wire Gauge: AWG #18 for input voltage connection. AWG #16 for output load connection.
Test Setup 5.3 www.ti.com List of Test Points Table 2. Test Point Functions 6 TEST POINTS NAME TP1 PGND Input voltage negative test point, for efficiency test DESCRIPTION TP2 Vin+ Input voltage positive test point, for efficiency test TP3 Bias_P1 Primary bias, 9V.
Test Procedure www.ti.com 6 Test Procedure Set up the EVM based on Figure 2. CAUTION High voltage and high temperature present when the EVM is in operation! 6.1 Line/Load Regulation and Efficiency Measurement Procedure 1. Connect the ammeter A1 (0 A to 10 A range) between DC Source and J1 as shown in Figure 2. 2. Prior to connecting the DC source, it is advisable to limit the source current to 4 A maximum. Make sure the DC source is initially set to 0 V and connected to J1 and A1 as shown in Figure 2.
Performance Data and Typical Characteristic Curves 7 www.ti.com Performance Data and Typical Characteristic Curves Figure 3 through Figure 11 present typical performance curves for UCC25230EVM-662. 7.1 Efficiency 100 95 90 Efficiency - % 85 80 75 70 65 60 55 36.0V 50 48.0V 45 72.0V 40 0 5 10 15 20 25 30 IOUT - Amps Figure 3. UCC25230EVM-662 Efficiency 7.2 Load Regulation 3.350 3.300 VOUT - V 3.250 3.200 3.150 36.0V 3.100 48.0V 72.0V 3.
Performance Data and Typical Characteristic Curves www.ti.com Bode Plots Gain - dB 7.3 50.00 150.00 40.00 120.00 30.00 90.00 20.00 60.00 10.00 30.00 0.00 0.00 -10.00 -30.00 -20.00 -60.00 -30.00 -90.00 Gain -40.00 Phase -120.00 -50.00 0.1 1.0 10.0 -150.00 100.0 F - Frequency - kHz Figure 5.
Performance Data and Typical Characteristic Curves 7.4 www.ti.com Turn-On Waveform Figure 6. Output Voltage Turn On (VIN = 48 V, IO = 15 A) 7.5 Turn-on Waveform with Pre-bias Output Voltage Figure 7. Output Voltage Turn on with Pre bias. (VIN = 48 V, IO = 0 A, Pre bias = 1.
Performance Data and Typical Characteristic Curves www.ti.com 7.6 Turn-On Waveform with Pre-bias Output Voltage Figure 8. Output Voltage Turn On with Pre bias. (VIN = 48 V, IO = 0 A, Pre bias = 3.0 V) 7.7 Turn-On Waveform with Pre-biased Output Voltage Figure 9.
Performance Data and Typical Characteristic Curves 7.8 www.ti.com Turn-Off Waveform Figure 10. Turn-Off Waveform (VIN = 48 V, IO = 15 A) 7.9 Output Ripple Figure 11.
EVM Assembly Drawing and PCB layout www.ti.com 8 EVM Assembly Drawing and PCB layout Figure 12 through Figure 17 show the design of the UCC25230EVM-754 printed circuit board. PCB dimensions: L x W = 4.2 inch x 2.3 inch, PCB material: FR406 or compatible, four layers and 2-ounce copper on each layer. Figure 12. UCC25230EVM-662 Top Layer Assembly Drawing (top view) Figure 13.
EVM Assembly Drawing and PCB layout www.ti.com Figure 14. UCC25230EVM-662 Top Copper (top view) Figure 15.
EVM Assembly Drawing and PCB layout www.ti.com Figure 16. UCC25230EVM-662 Internal Layer 2 (top view) Figure 17.
List of Materials 9 www.ti.com List of Materials The EVM components list according to the schematic shown in Figure 1 Table 3. UCC25230EVM-662 List of Materials QTY 16 REF DES DESCRIPTION PART NUMBER MFR 4 C1, C35, C41, C42 Capacitor, ceramic, 16 V, X7R, ±10%, 1 µF, 0603 Std Std 3 C10, C37, C39 Capacitor, ceramic, 50 V, NP0, ±10%, 100 pF, 0603 Std Std 3 C11, C29, C30 Capacitor, ceramic, 50 V, X7R, ±10%, 2.
List of Materials www.ti.com Table 3. UCC25230EVM-662 List of Materials (continued) QTY REF DES DESCRIPTION PART NUMBER MFR 3 R15, R45, R47 Resistor, chip, 1/16 W, ±1%, 0 Ω, 0603 Std Std 1 R16 Resistor, chip, 1/16 W, ±1%, 75.0 kΩ, 0603 Std Std 2 R17, R19 Resistor, chip, 1/16 W, ±1%, 402 Ω, 0603 Std Std 1 R18 Resistor, chip, 1/16 W, ±1%, 4.64 kΩ, 0603 Std Std 2 R2, R13 Resistor, chip, 1/16 W, ±1%, 5.11 kΩ, 0603 Std Std 1 R20 Resistor, chip, 1/16 W, ±1%, 6.
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