Datasheet

UCC24610
www.ti.com SLUSA87B –AUGUST 2010–REVISED SEPTEMBER 2010
THERMAL INFORMATION
UCC24610
THERMAL METRIC
(1)
D DRB UNITS
8 PINS 8 PINS
q
JA
Junction-to-ambient thermal resistance
(2)
147 67
q
JCtop
Junction-to-case (top) thermal resistance
(3)
89 84.6
°C/W
q
JB
Junction-to-board thermal resistance
(4)
82 20.3
q
JCbot
Junction-to-case (bottom) thermal resistance
(5)
7.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
RECOMMENDED OPERATING CONDITIONS
All voltages are with respect to GND; currents are positive into and negative out of the specified terminal. −40°C < T
J
= T
A
<
125°C. (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
V
IN
VCC input voltage 4.5 5.5 V
VCC bypass capacitor 0.1 - µF
T
J
Junction temperature -40 125 °C
f
S
Switching frequency 20 600 kHz
TON-to-GND resistor 10 261
kΩ
EN/TOFF-to-GND resistor 93 280
SYNC pulse width at V
THSYNC
-0.1V 20 - ns
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