Datasheet

UCC24610
SLUSA87B AUGUST 2010REVISED SEPTEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT INFORMATION
PART NUMBER PACKAGE OPERATING TEMPERATURE RANGE, T
A
UCC24610D SOIC 8-Pin (D) Lead(Pb)-Free/Green
-40°C to 125°C
UCC24610DRB QFN 8-Pin (DRB) Lead(Pb)-Free/Green
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC -0.3 6.5
EN/TOFF
(3)
-0.3 VCC
Input voltage range
(2)
TON
(4)
-0.3 VCC V
VD for I
VD
-10 mA -1.0 50
VS for I
VS
-10 mA -1.0 0.5
Input current, peak SYNC
(5)
pulsed, t
PULSE
4 ms, Duty cycle 1% ±100 mA
Output current, peak GATE
(6)
pulsed, t
PULSE
4 ms, Duty cycle 1% ±3 A
Human body model HBM 2,000
V
Charged device model CDM 500
Operating -40 125
Junction temperature, T
J
°C
Storage -65 150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those included under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
(2) Input voltages more negative than indicated may exist on any listed pin without excess stress or damage to the device if the pin’s input
current magnitude is limited to less than -10mA. See separate ratings for SYNC and GATE pins.
(3) EN/TOFF can be driven by a voltage within the specified absolute maximum range or connected to a resistor to ground. Either method
will program maximum off-time. When programmed by a resistor to GND, the voltage at the EN/TOFF terminal is internally limited to
<VCC regardless of resistor value, so no absolute maximum input voltage considerations are required.
(4) In normal use, TON is connected to a resistor to GND. TON is normally not connected to a voltage source. When TON is connected to
ground through a resistor, no absolute maximum input voltage considerations are required.
(5) In normal use, SYNC is connected with a capacitor to a high-speed voltage-transition source. The capacitor value shall be selected in
conjunction with the worst-case voltage slew-rate to insure that the current into or out of SYNC is not in excess of the SYNC absolute
maximum input current rating, or a current-limiting series resistor may also be necessary. In this use, if the input current is limited to less
than the absolute maximum, no absolute maximum input voltage considerations are required. The capacitor breakdown voltage shall be
selected to insure that dangerous voltage is not applied to the UCC24610. Continuous SYNC current is subject to the maximum
operating junction temperature limitation.
(6) In normal use, GATE is connected to the gate of a power MOSFET through a small resistor. When used this way, GATE current is
limited by the UCC24610 and no absolute maximum output current considerations are required. The series resistor shall be selected to
minimize overshoot and ringing due to series inductance of the GATE output and power-MOSFET gate-drive loop. Continuous GATE
current is subject to the maximum operating junction temperature limitation.
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