Datasheet

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
UC2872DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2872DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2872DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2872DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2872N ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2872NG4 ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2872Q ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br)
CU SN Level-2-260C-1 YEAR
UC2872QG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br)
CU SN Level-2-260C-1 YEAR
UC3872DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872M ACTIVE SSOP/
QSOP
DBQ 16 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872MG4 ACTIVE SSOP/
QSOP
DBQ 16 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872MTR ACTIVE SSOP/
QSOP
DBQ 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872MTRG4 ACTIVE SSOP/
QSOP
DBQ 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3872N ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3872NG4 ACTIVE PDIP N 14 25 Green (RoHS &
no Sb/Br)
CU NIPDAU N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com 4-May-2009
Addendum-Page 1