Datasheet

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ABSOLUTE MAXIMUM RATINGS
(1)
CONNECTION DIAGRAMS
1
2
3
4
8
7
6
5
COMP
V
FB
I
SENSE
R
T
/C
T
V
REF
V
CC
OUTPUT
GROUND
DIL-8, SOIC-8
N or J PACKAGE, D8 PACKAGE
(TOP VIEW)
NC − No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
COMP
NC
V
FB
NC
I
SENSE
NC
R
T
/C
T
SOIC-14, CFP-14
D or W PACKAGE
(TOP VIEW)
V
REF
NC
V
CC
V
C
OUTPUT
GROUND
PWR GND
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
V
CC
V
C
NC
OUTPUT
NC
NC
V
FB
NC
I
SENSE
NC
PLCC-20
Q PACKAGE
(TOP VIEW)
NC
COMP
NC
PWR GND
GROUND
NC
NC
NC
R
T
/C
T
V
REF
UC1842/3/4/5
UC2842/3/4/5
UC3842/3/4/5
SLUS223C – APRIL 1997 – REVISED JUNE 2007
UNIT
Low impedance source 30 V
Supply voltage
I
CC
< 30 mA Self Limiting
Output current ± 1 A
Output energy (capacitive load) 5 µ J
Analog inputs (Pins 2, 3) –0.3 V to 6.3 V
Error amp output sink current 10 mA
T
A
≤ 25 ° C (DIL-8) 1 W
Power dissipation T
A
≤ 25 ° C (SOIC-14) 725 mW
T
A
≤ 25 ° C (SOIC-8) 650 mW
Storage temperature range –65 ° C to 150 ° C
Junction temperature range –55 ° C to 150 ° C
Lead temperature (soldering, 10 seconds) 300 ° C
(1) All voltages are with respect to Pin 5. All currents are positive into the specified terminal. Consult Packaging Section of Databook for
thermal limitations and considerations of packages.
2
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