Datasheet


SGLS318 − NOVEMBER 2005
3
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PACKAGE DESCRIPTION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
PKLMT
CAO
ISENSE
MOUT
IAC
VAO
VRMS
GTDRV
VCC
CT
SS
RSET
VSENSE
ENA
VREF
DW PACKAGE
(TOP VIEW)
ORDERING INFORMATION
T
A
UVLO
TURN-ON
UVLO
PART NUMBERS
T
A
TURN-ON
(V)
UVLO
TURN-OFF (V)
SOIC−16 (DW)
−55°C to 125°C 10.5 10 UC2854BMDWREP
(1)
The DW package is available taped and reeled. Add TR suffix to device type to order quantities of 2,000 devices per reel for the DW
package.
THERMAL RESISTANCE
RESISTANCES
SOIC (DW)
RESISTANCES
HIGH LOW
θ
JC
(°C/W) 36.9 38.4
θ
JA
(°C/W)
(3)
73.1
111.6
(3)
θ
JA
values are based on zero air flow.
T
J
− Junction Temperature − °C
Time-to-Fail − Hrs
80°C, 74M Hrs
100°C, 5.3M Hrs
120°C, 490k Hrs
140°C, 58k Hrs
10k
1M
1G
100k
10M
100M
10080 90 110 120 130 140 150
90°C, 19M Hrs
110°C, 1.6M Hrs
130°C, 160k Hrs
Figure 1. Wirebond Operating Life Derating Chart