Datasheet

µ 
 
SLVS060K − JUNE 1976 − REVISED APRIL 2005
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic
4.5 kΩ
to 6.3 kΩ
COMMON
OUTPUT
INPUT
0.1 Ω
0.2 Ω
1.7 kΩ
to 18 kΩ
Resistor values shown are nominal.
absolute maximum ratings over virtual junction temperature range (unless otherwise noted)
†
Input voltage, V
I
35 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, T
J
150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
package thermal data (see Note 1)
PACKAGE BOARD θ
JC
θ
JA
θ
JP
‡
PowerFLEX (KTP) High K, JESD 51-5 19°C/W 28°C/W 1.4°C/W
TO-220 (KC/KCS) High K, JESD 51-5 17°C/W 19°C/W 3°C/W
NOTE 1: Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) − T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
‡
For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θ
JP
is defined as the thermal resistance between the die
junction and the bottom of the exposed pad.