Datasheet

µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741Y chip information
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C.
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
+
–
OUT
IN+
IN–
V
CC+
(7)
(3)
(2)
(6)
(4)
V
CC–
(5)
(1)
OFFSET N2
OFFSET N1
45
36
(1)
(8)
(7) (6)
(5)
(4)
(3)(2)