Datasheet

DataData
A1 B1
V
CCA
V
CCB
OE
1.8 V
System
Controller
3.3 V
System
3.3 V
1.8 V
A2 B2
0.1 mF0.1 mF 1 mF
TXS0102
SCES640D –JANUARY 2007– REVISED MARCH 2011 www.ti.com
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000 TXS0102YZPR 2H_
0.23-mm Large Bump – YZP
SON – DQE Reel of 5000 TXS0102DQER 2H
SON – DQM Reel of 3000 TXS0102DQMR 2HR
–40°C to 85°C
Reel of 3000 TXS0102DCTR NFE_ _ _
SSOP – DCT
Tube of 250 TXS0102DCTT NFE _ _ _
VSSOP – DCU Reel of 3000 TXS0102DCUR NFE_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DCT: The actual top-side marking has three additional characters that designate the year, month, and wafer fab/assembly site.
DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO.
NAME TYPE FUNCTION
DCT, DQE,
YZP
DCU DQM
1 6 A1 B2 I/O Input/output B. Referenced to V
CCB
.
2 4 B1 GND GND Ground
3 1 C1 V
CCA
Power A-port supply voltage. 1.65 V ≤ V
CCA
≤ 3.6 V and V
CCA
≤ V
CCB
4 3 D1 A2 I/O Input/output A. Referenced to V
CCA
.
5 2 D2 A1 I/O Input/output A. Referenced to V
CCA
.
Output enable (active High). Pull OE low to place all outputs in 3-state mode.
6 5 C2 OE Input
Referenced to V
CCA
.
7 8 B2 V
CCB
Power B-port supply voltage. 2.3 V ≤ V
CCB
≤ 5.5 V
8 7 A2 B1 I/O Input/output B. Referenced to V
CCB
.
TYPICAL OPERATING CIRCUIT
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Product Folder Link(s): TXS0102