Datasheet

Data
GNDGNDGND
Data A B
V
CCA
V
CCB
OE
1.8 V
System
Controller
3.3 V
System
3.3 V1.8 V
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 ............................................................................................................................................. www.ti.com
ORDERING INFORMATION
ORDERABLE TOP-SIDE
T
A
PACKAGE
(1) (2)
PART NUMBER MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 TXS0101YZPR _ _ _2G_
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 TXS0101DBVR
SOT (SOT-23) – DBV NFF_
Reel of 250 TXS0101DBVT
– 40 ° C to 85 ° C
Reel of 3000 TXS0101DCKR
SOT (SC-70) – DCK 2G_
Reel of 250 TXS0101DCKT
Reel of 3000 TXS0101DRLR
SOT (SOT-563) – DRL 2G_
Reel of 250 TXS0101DRLT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO. NAME FUNCTION
1 V
CCA
A-port supply voltage. 1.65 V ≤ V
CCA
≤ 3.6 V and V
CCA
≤ V
CCB
2 GND Ground
3 A Input/output A. Referenced to V
CCA
.
4 B Input/output B. Referenced to V
CCB
.
5 OE Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to V
CCA
.
6 V
CCB
B-port supply voltage. 2.3 V ≤ V
CCB
≤ 5.5 V
TYPICAL OPERATING CIRCUIT
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Product Folder Link(s): TXS0101