Datasheet

Data
GNDGNDGND
Data A1 B1
V
CCA
V
CCB
OE
1.8-V
System
Controller
3.3-V
System
1.8 V 3.3 V
Data A2
DataB2
0.1 µF
0.1 µF
TXB0102
SCES641B –MAY 2007–REVISED MAY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Reel of 3000 TXB0102YZPR 2E_
free)
Reel of 3000 TXB0102DCTR
–40°C to 85°C
SOT (SOT-23) – DCT NFD_
Reel of 250 TXB0102DCTT
Reel of 3000 TXB0102DCUR
SOT (SOT-70) – DCU NFD_
Reel of 250 TXB0102DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
(3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Table 1. PIN DESCRIPTION
PIN NAME FUNCTION
1 B2 Input/output B. Referenced to V
CCB
.
2 GND Ground
3 V
CCA
A port supply voltage. 1.2 V ≤ V
CCA
≤ 3.6 V and V
CCA
≤ V
CCB
4 A2 Input/output A. Referenced to V
CCA
.
5 A1 Input/output A. Referenced to V
CCA
.
6 OE 3-State output. Pull OE low to place all outputs in 3-state mode. Referenced to V
CCA
.
7 V
CCB
B port supply voltage. 1.65 V ≤ V
CCB
≤ 5.5 V
8 B1 Input/output B. Referenced to V
CCB
.
Figure 1. TYPICAL OPERATING CIRCUIT
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Product Folder Link(s): TXB0102