Datasheet

TVP5158, TVP5157, TVP5156
SLES243G –JULY 2009–REVISED APRIL 2013 www.ti.com
5.9.1 I
2
S Port Timing
NOTE
Philips I
2
S bus compliant (specified by design) – See the Philips I
2
S bus specification
5.10 Miscellaneous Timings
PARAMETER MIN TYP MAX UNIT
t
RESET
RESETB Signal Low Time for valid reset 20 ms
t
valid
I
2
C valid time, Initialization time after reset until I
2
C ready 260 µs
5.11 Power Dissipation Ratings
PARAMETER TEST CONDITIONS
(1)
MIN TYP MAX UNIT
Thermal PAD soldered to 4-layer
θ
JA
Junction-to-ambient thermal resistance, still air 17.17 °C/W
High-K PCB
Thermal PAD soldered to 4-layer
θ
JC
Junction-to-case thermal resistance, still air 0.12 °C/W
High-K PCB
T
J
(max) Maximum junction temperature for reliable operation 105 °C
(1) Exposed thermal pad must be soldered to JEDEC High-K PCB with adequate ground plane (see Section 6.5).
96 Electrical Specifications Copyright © 2009–2013, Texas Instruments Incorporated
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