Datasheet

TVP5146M2
SLES141H –JULY 2005– REVISED FEBRUARY 2012 www.ti.com
3.9 Thermal Specifications
PARAMETER TEST CONDITIONS
(1)
MIN TYP MAX UNIT
Junction-to-ambient thermal resistance,
θ
JA
Thermal pad soldered to 4-layer High-K PCB 19.04 °C/W
still air
Junction-to-case thermal resistance, still
θ
JC
Thermal pad soldered to 4-layer High-K PCB 0.17 °C/W
air
Maximum junction temperature for
T
J(MAX)
105 °C
reliable operation
(1) The exposed thermal pad must be soldered to a High-K PCB with adequate ground plane.
96 Electrical Specifications Copyright © 2005–2012, Texas Instruments Incorporated
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