Datasheet
TUSB9261
www.ti.com
SLLSE67F –MARCH 2011–REVISED JULY 2013
7 ELECTRICAL SPECIFICATIONS
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
VDD Steady-state supply voltage –0.3 to 1.4 V
VDD33/
Steady-state supply voltage –0.3 to 3.8 V
VDDA33
7.2 Thermal Information
TUSB9261
THERMAL METRIC PVP UNITS
64 PINS
θ
JA
Junction-to-ambient thermal resistance
(1)
30.2
θ
JCtop
Junction-to-case (top) thermal resistance
(2)
11.0
θ
JB
Junction-to-board thermal resistance
(3)
6.1
°C/W
ψ
JT
Junction-to-top characterization parameter
(4)
0.4
ψ
JB
Junction-to-board characterization parameter
(5)
6.1
θ
JCbot
Junction-to-case (bottom) thermal resistance
(6)
0.9
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(5) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Digital 1.1 supply voltage 1.045 1.1 1.155 V
VDD33 Digital 3.3 supply voltage 3 3.3 3.6 V
VDDA33 Analog 3.3 supply voltage 3 3.3 3.6 V
VBUS Voltage at VBUS PAD 0 1.155 V
0 70
T
A
Operating free-air temperature range °C
Industrial version -40 85
T
J
Operating junction temperature range -40 100 °C
HBM ESD 2000 V
CDM ESD 500 V
Copyright © 2011–2013, Texas Instruments Incorporated ELECTRICAL SPECIFICATIONS 19
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