Datasheet

Pin 1 Indicator
TUSB1210BRHB
YMLLLLS
$
TUSB1210
www.ti.com SLLSE09F –NOVEMBER 2009–REVISED AUGUST 2012
12 TUSB1210 Package
12.1 TUSB1210 Standard Package Symbolization
Figure 12-1. Printed Device Reference
Table 12-1. TUSB1210 Nomenclature Description
FIELDS MEANING
P Marking used to note prototype (X), preproduction (P), or
qualified/production device (Blank)(1)
A Mask set version descriptor (initial silicon = BLANK, first
silicon revision = A, second silicon revision = B,...)(2)
YM Year month
LLLLS Lot code
$ Fab Planning Code
12.2 Package Thermal Resistance Characteristics
Table 12-2 provides the thermal resistance characteristics for the recommended package type RHB (S-
PQFP-N32) used for the TUSB1210 device. Refer to the application report IC Package Thermal Metrics,
TI literature number SPRA953, further details concerning parameter definitions and usage.
Table 12-2. TUSB1210 Thermal Resistance Characteristics
PARAMETER VALUE UNIT MEASUREMENT METHOD
θ
JA
Junction-to-ambient thermal resistance 34.72 °C/W EIA/JESD 51-1
θ
JC
top Junction-to-case top thermal resistance
(1)
37.3 °C/W No current JEDEC specification
(2)
θ
JC
Junction-to-case bottom thermal resistance
(3)
3.6 °C/W No current JEDEC specification
(2)
bottom
θ
JB
Junction-to-board thermal resistance or junction- 10.3 °C/W EIA/ JESD 51-8.
to-pin thermal resistance
Ψ
JT
Junction-to-top of package (not a true thermal 0.5 °C/W EIA/JESD 51-2
resistance)
Ψ
JB
Junction-to-board (not a true thermal resistance) 10.5 °C/W EIA/JESD 51-6
(1) Top is surface of the package facing away from the PCB.
(2) Refer to measurement method in Chapter 2 of IC Package Thermal Metrics, TI literature number SPRA953.
(3) Bottom surface is the surface of the package facing towards the PCB.
Copyright © 2009–2012, Texas Instruments Incorporated TUSB1210 Package 57
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