Datasheet

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14 Component Layout ......................................................................................................... 29
15 Top PCB Layer ............................................................................................................. 30
16 Power/Ground Plane 1 .................................................................................................... 31
17 Power/Ground Plane 2 .................................................................................................... 32
18 Bottom PCB Layer ......................................................................................................... 33
19 Bottom Silkscreen and Solder Mask ..................................................................................... 34
20 TSC2111EVM/TLV320AIC29EVM Schematic, Page 1 ............................................................... 35
21 TSC2111EVM/TLV320AIC29EVM Schematic, Page 2 ............................................................... 36
22 USB Board Schematic, Page 1 ........................................................................................... 37
23 USB Board Schematic, Page 2 ........................................................................................... 38
List of Tables
1 TSC2111EVM Board Default Configuration Settings ................................................................... 4
2 USBMODEVM Board Default Configuration Settings ................................................................... 5
3 Analog Interface Pinout .................................................................................................... 23
4 Analog Connectors ......................................................................................................... 24
5 Digital Interface Pinout..................................................................................................... 24
6 Power Supply Pin Out ..................................................................................................... 25
7 TSC2111EVM Bill of Materials ........................................................................................... 27
TSC2111EVM and TSC2111EVM-PDK2 SLAU178 – April 2006
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