Datasheet
TSC2017
SBAS472 –DECEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
TYPICAL TYPICAL NO MISSING
INTEGRAL GAIN CODES SPECIFIED TRANSPORT
LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY
Small Tape
TSC2017IYZGT
12-Pin,
and Reel, 250
TSC2017I ±1.5 0.1 11 3 x 4 Array, YZG –40°C to +85°C TSC2017I
Tape and
WCSP
TSC2017IYZGR
Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
TSC2017 UNIT
Analog input X+, Y+, AUX to GND –0.4 to V
DD
+ 0.1 V
Voltage range Analog input X–, Y– to GND –0.4 to V
DD
+ 0.1 V
VDD/REF pin to GND –0.3 to +5 V
Digital input voltage to GND –0.3 to V
DD
+ 0.3 V
Digital output voltage to GND –0.3 to V
DD
+ 0.3 V
Power dissipation (T
J
Max - T
A
)/θ
JA
Low-K 113
Thermal impedance, θ
JA
WCSP package °C/W
High-K 62
Operating free-air temperature range, T
A
–40 to +85 °C
Storage temperature range, T
STG
–65 to +150 °C
Junction temperature, T
J
Max +150 °C
IEC contact discharge
(2)
X+, X–, Y+, Y– ±15 kV
IEC air discharge
(2)
X+, X–, Y+, Y– ±25 kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
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